
Boosting Individual Applications with On-Point Features
Intel® Xeon® 6 is a new generation of processors that has tailored its CPU lineup to target all uses cases such as Cloud Computing, AI, Analytics, and Edge & IOT. Whether it’s high compute density that is dependent on core count and power efficiency or AI/HPC applications that heavily rely on strong single-core performance, this new platform covers them all with its Performance cores (P-cores) and Efficient-cores (E-cores). Along with flexible I/O options, integrated accelerators, and support for CXL 2.0 devices, Intel Xeon 6 fulfills customer needs across the broadest range of data center workloads, segments, and deployment models.

Core Technology Aligned with Aspirations
Acceleratorsbuilt-in*
Incredible performance and efficiency improvements with the easy adoption of on-chip accelerators
8 or 12Channels
Increased memory frequency and throughput with DDR5 RDIMM support
PCIe 5.0lanes
Up to 136 lanes for 1S designs, supporting all the latest drives and accelerators
CXL 2.0support**
Flexible support between PCIe and CXL, utilizing DDR5 and CXL memory as one unified region
Up to 288E-cores per CPU
Core dense and optimized efficiency for cloud-native and hyperscale workloads
Up to 128P-cores per CPU
Greater core performance with improved TCO, accelerating AI and compute intensive workloads
MRDIMMsupport
Unprecedented frequency on the advanced MRDIMM, boosting memory-intensive application to a whole new level
* Different on-chip accelerators are supported depending on CPU SKUs, and they require a one-time activation. Please visit Intel’s official website or contact technical support for details.
** CXL peripheral support varies by product. Please refer to the QVL list for validated configurations.
Why Choose GIGABYTE Liquid Cooling Servers?
Cool Performance
Servers will run incredibly stable and have high-performance from liquid cooled components that operate well below CPU TDP.
Power Saving
A liquid cooled server with less fans and running at lower speeds can achieve the same performance as an air-cooled server while consuming less power.
Noise Reduction
Servers require a lot of high-speed, high noise fans. GIGABYTE has found a way to reduce the noise by reducing the number of fans while using a liquid cooling solution.
Proven Track Record
The direct liquid cooling system supplier has 20 years of experience in cooling solutions for desktops PCs & data centers. GIGABYTE has 20+ years of experience as well.
Reliability
Liquid cooling solutions can be monitored with little need for maintenance. GIGABYTE and liquid cooling suppliers have warranties to cover components.
Ease of Use
GIGABYTE servers paired with a liquid cooling kit can be mounted in a rack or connected to a building’s water system. And offers quick/easy/dry disconnects.
G4L4-AD1-LAX5 Product Overview


G4L4-AD1-LAX5 Block Diagram

High Performance
Supports NVIDIA HGX™ B200
The NVIDIA HGX™ B200 propels the data center into a new era of accelerating computing and generative AI, integrating NVIDIA Blackwell Tensor Core GPUs with a high-speed interconnect to accelerate AI performance at scale. Configurations of eight GPUs deliver unparalleled generative AI acceleration alongside a remarkable 1.4 TB of GPU memory and 64 TB/s of memory bandwidth for 15X faster real-time trillion-parameter-model inference, 12X lower cost, and 12X less energy. This extraordinary combination positions HGX B200 as a premier accelerated x86 scale-up platform designed for the most demanding generative AI, data analytics, and HPC workloads. HGX B200 supports advanced networking options—at speeds up to 400 Gb/s—delivering the highest AI performance with NVIDIA Quantum-2 InfiniBand and the Spectrum™-X Ethernet platform. HGX B200 with NVIDIA® BlueField®-3 DPUs enable cloud networking, composable storage, zero-trust security, and GPU compute elasticity in hyperscale AI clouds.

Power Efficiency
Automatic Fan Speed Control
GIGABYTE servers are enabled with Automatic Fan Speed Control to achieve the best cooling and power efficiency. Individual fan speeds will be automatically adjusted according to temperature sensors strategically placed in the servers.

User Friendly

Full-Height Add-In Cards
Support full-height add-in cards on all PCIe expansion slots to accommodate DPUs and SuperNICs.

Easy Maintenance
PCIe cage design and front-access motherboard/GPU trays for streamlined maintenance.

Flexible PSU Configuration
Hot-swappable, fully redundant PSUs with multiple connector options for enhanced flexibility.
447 x 175.3 x 901
– Intel® Xeon® 6900-Series ProcessorsDual processor, TDP up to 500 W
[Note] If only 1 CPU is installed, some PCIe or memory functions might be unavailable.
Socket BR
Support DDR5 RDIMM/MRDIMM [1]
12-Channel memory per processor
RDIMM: Up to 6400 MT/s
MRDIMM: Up to 8800 MT/s[1] MRDIMMs are supported only on select Intel® Xeon® 6 processors with P-cores.
2 x 10 Gb/s LAN (1 x Intel® X710-AT2)
– Support NCSI function1 x 10/100/1000 Mb/s Management LAN
Rear (MLAN board):
1 x 10/100/1000 Mb/s Management LAN
[Note] When both MLAN ports are connected with cables, the front MLAN port will be set as the default.
– 1 x VGA port
8 x 2.5″ Gen5 NVMe
– (NVMe from PEX89104)Internal M.2:
1 x M.2 (2280/22110), PCIe Gen5 x4, from CPU_1
1 x M.2 (2280/22110), PCIe Gen5 x2, from CPU_1
4 x FHHL x16 (Gen5 x16), from PEX89048[Note] The ambient temperature is limited to 30°C when NVIDIA® BlueField®-3 DPUs/SuperNIC™ are installed.
2 x USB 3.2 Gen1 ports (Type-A)
1 x VGA port
2 x RJ45 ports
1 x MLAN port (default)
1 x Power button with LED
1 x ID button with LED
1 x NMI button
1 x Reset button
1 x Storage activity LED
1 x System status LED
1 x MLAN port
– Optional TPM 2.0 kit: CTM012
4+4 3000 W 80 PLUS Titanium redundant power supplies [1]
AC Input:
– 115-127V~/ 14.2A, 50-60Hz
– 200-220V~/ 15.8A, 50-60Hz
– 220-240V~/ 14.9A, 50-60Hz
DC Input: (Only for China)
– 240Vdc/ 14A
DC Output:
– Max 1450W/ 115-127V~
+54V/ 26.6A
+12Vsb/ 3A
– Max 2900W/ 200-220V~
+54V/ 53.4A
+12Vsb/ 3A
– Max 3002.4W/ 220-240V~ or 240Vdc Input
+54V/ 55.6A
+12Vsb/ 3A
[1] The system power supply requires C19 power cord.
2 x 60x60x56mm
2 x 60x60x76mmPCIe slots:
4 x 80x80x56mm
GPU tray:
4 x 60x60x38mm
Operating humidity: 8% to 80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20% to 95% (non-condensing)[Note] To ensure system stability and prevent condensation, when the relative humidity exceeds 50%, the coolant inlet temperature must be higher than the dry-bulb temperature and it should not exceed 45°C.
2 x Carriers
1 x L-shape Rail kit
– Motherboard: 9MAB4PE0UR-000*
– L-shape Rail kit: 25HB2-A96102-K0R
– Front panel board – CFPG440: 9CFPG440NR-00*
– Backplane board – CBPG641: 9CBPG641NR-00*
[#2] All materials provided herein are for reference only. GIGABYTE reserves the right to modify or revise the content at any time without prior notice.
[#3] Advertised performance is based on maximum theoretical values as specified by the respective chipset vendors or standards organizations. Actual performance may vary depending on system configuration.
[#4] All trademarks and logos are the property of their respective owners.

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