NVIDIA® NVLink®-C2C extends the industry-leading NVLink technology to a chip-to-chip interconnect. This enables the creation of a new class of integrated products with NVIDIA partners, built via chiplets, allowing NVIDIA GPUs, DPUs, and CPUs to be coherently interconnected with custom silicon.

The design and layout of a chip-to-chip interconnect is vital to proper function, performance, power efficiency, reliability, and fabrication yield. NVIDIA NVLink-C2C is built on top of the world-class SerDes and Link design technology. With advanced packaging, NVLink-C2C interconnect delivers up to 25X more energy efficiency and 90X more area-efficiency than a PCIe Gen 5 PHY on NVIDIA chips. NVLink-C2C is extensible from PCB-level integration, multi-chip modules (MCM), and silicon interposer or wafer-level connections, enabling the industry’s highest bandwidth, while optimizing for both energy and area efficiency. The NVLink-C2C technology will be available for customers and partners who want to create semi-custom system designs.