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Architecture for Modern Data Centers
Enterprise Solutions for AMD EPYC™ 9005 Series Processors
New AMD EPYC™ Family of Processors – Same Great SP5 Platform
The SP5 socket has reached its pinnacle form with 5th Generation AMD EPYC™ processors. The same successful platform that was shared by AMD EPYC™ 9004 & 8004 series processors is now the same one for AMD EPYC™ 9005 series processors. With up to 192 cores, increased frequencies and cache, this top tier performance platform targets general purpose, cloud native, and technical computing. Building on the advantages of the EPYC™ 9004 series, the new EPYC™ 9005 series adopts the 3nm process with AMD “Zen5” and “Zen5c” core architecture, excelling in both energy efficiency and cost optimization. GIGABYTE has already prepared for this new processor with new servers and updates to existing products for 4th Gen AMD EPYC™ processors.
5th Generation AMD EPYC™ Processors for SP5 Socket
3nmarchitecture
Increased transistor density alongside a reduction in power consumption
Up to 192CPU cores
Dedicated “Zen 5” & “Zen 5c” cores increase compute density
Up to 512MBL3 cache
An L3 cache increase helps to reduce latency in data-intensive operations
12channels
Memory capacity up to 9TB in a 2 DIMM per channel configuration
Up to 160PCIe lanes
Dual socket configuration adds a significant amount of I/O connectivity
CXL 2.0support
Disaggregated compute architecture possible via Compute Express Link
- AMD EPYC™ 9005 Series processors require OEM enablement and a BIOS update from your server or motherboard manufacturer if used with a motherboard designed for the SP5 socketed AMD EPYC™ 9004 Series processors. Contact your system manufacturer prior to purchase to determine compatibility.
- CXL Type 1&2 devices and PCIe link encryption support dependent upon ecosystem readiness; type 2 PoC only.
- CXL peripheral support varies by product. Please refer to the QVL list for validated configurations.
Select GIGABYTE for the AMD EPYC™ 9005 Platform
High Performance
Servers and motherboards by GIGABYTE are tested to ensure peak performance for demanding workloads while supporting the latest GPU and CXL technology.
Compute Density
With 192 CPU cores per socket, GIGABYTE’s 4-node servers support up to 1,536 CPU cores, allowing a far greater number of concurrent tasks to be done.
Fast & Stable Connectivity
Keeping pace with the challenges for next gen technology, well designed GIGABYTE boards provide users the signal integrity for fast PCIe 5.0 speeds.
Collaboration
AMD and GIGABYTE have maintained a healthy relationship that values shared knowledge and open communication in order to launch products in tandem.
Optimal Price
Our broad portfolio of products tailored to applications allow customers to only select server features they require while doing so at a lower TCO.
G4L3-ZD1-LAX5 Product Overview
G4L3-ZD1-LAX5 Block Diagram
Why Choose GIGABYTE Liquid Cooling Servers?
Cool Performance
Servers will run incredibly stable and have high-performance from liquid cooled components that operate well below CPU TDP.
Power Saving
A liquid cooled server with less fans and running at lower speeds can achieve the same performance as an air-cooled server while consuming less power.
Noise Reduction
Servers require a lot of high-speed, high noise fans. GIGABYTE has found a way to reduce the noise by reducing the number of fans while using a liquid cooling solution.
Proven Track Record
The direct liquid cooling system supplier has 20 years of experience in cooling solutions for desktops PCs & data centers. GIGABYTE has 20+ years of experience as well.
Reliability
Liquid cooling solutions can be monitored with little need for maintenance. GIGABYTE and liquid cooling suppliers have warranties to cover components.
Ease of Use
GIGABYTE servers paired with a liquid cooling kit can be mounted in a rack or connected to a building’s water system. And offers quick/easy/dry disconnects.
High Performance
Supports NVIDIA HGX™ B200
The NVIDIA HGX™ B200 propels the data center into a new era of accelerating computing and generative AI, integrating NVIDIA Blackwell Tensor Core GPUs with a high-speed interconnect to accelerate AI performance at scale. Configurations of eight GPUs deliver unparalleled generative AI acceleration alongside a remarkable 1.4 TB of GPU memory and 64 TB/s of memory bandwidth for 15X faster real-time trillion-parameter-model inference, 12X lower cost, and 12X less energy. This extraordinary combination positions HGX B200 as a premier accelerated x86 scale-up platform designed for the most demanding generative AI, data analytics, and HPC workloads. HGX B200 supports advanced networking options—at speeds up to 400 Gb/s—delivering the highest AI performance with NVIDIA Quantum-2 InfiniBand and the Spectrum™-X Ethernet platform. HGX B200 with NVIDIA® BlueField®-3 DPUs enable cloud networking, composable storage, zero-trust security, and GPU compute elasticity in hyperscale AI clouds.
Hardware Security
Optional TPM 2.0 Module
For hardware-based authentication, the passwords, encryption keys, and digital certificates are stored in a TPM module to prevent unwanted users from gaining access to your data. GIGABYTE TPM modules come in either a Serial Peripheral Interface or Low Pin Count bus.
Power Efficiency
Automatic Fan Speed Control
GIGABYTE servers are enabled with Automatic Fan Speed Control to achieve the best cooling and power efficiency. Individual fan speeds will be automatically adjusted according to temperature sensors strategically placed in the servers.
User Friendly
Full-Height Add-In Cards
Support full-height add-in cards on all PCIe expansion slots to accommodate DPUs and SuperNICs.
Easy Maintenance
PCIe cage design and front-access motherboard/GPU trays for streamlined maintenance.
Flexible PSU Configuration
Hot-swappable, fully redundant PSUs with multiple connector options for enhanced flexibility.
447 x 175.5 x 901
AMD EPYC™ 9004 Series Processors
Dual processor, cTDP up to 500W
[Note] If only 1 CPU is installed, some PCIe or memory functions might be unavailable.
Socket SP5
Support DDR5 RDIMM
12-Channel memory per processor
AMD EPYC™ 9005:
Up to 6400 MT/s
AMD EPYC™ 9004:
Up to 4800 MT/s
2 x 10Gb/s LAN (1 x Intel® X710-AT2)
– Support NCSI function
1 x 10/100/1000 Mbps Management LAN
Rear (MLAN board – CDB66):
1 x 10/100/1000 Mbps Management LAN
[Note] When both MLAN ports are connected with cables, the front MLAN port will be set as the default.
– 1 x VGA port
8 x 2.5″ Gen5 NVMe
– (NVMe from PEX89104)
Internal M.2:
1 x M.2 (2280/22110), PCIe Gen3 x4, from CPU_1
1 x M.2 (2280/22110), PCIe Gen3 x1, from CPU_0
– 8 x FHHL x16 (Gen5 x16), from PEX89104
PCIe Bridge Board – CPBG045 x 2:
– 4 x FHHL x16 (Gen5 x16), from PEX89048
[Note] The ambient temperature is limited to 30°C when NVIDIA® BlueField®-3 DPUs/SuperNIC™ are installed.
2 x USB 3.2 Gen1 ports (Type-A)
1 x VGA port
2 x RJ45 ports
1 x MLAN port (default)
1 x Power button with LED
1 x ID button with LED
1 x NMI button
1 x Reset button
1 x Storage activity LED
1 x System status LED
1 x MLAN port
PCIe Gen5 x4
– Optional TPM2.0 kit: CTM012
AC Input:
– 115-127V~/ 14.2A, 50-60Hz
– 200-220V~/ 15.8A, 50-60Hz
– 220-240V~/ 14.9A, 50-60Hz
DC Input: (Only for China)
– 240Vdc/ 14A
DC Output:
– Max 1450W/ 115-127V~
+54V/ 26.6A
+12Vsb/ 3A
– Max 2900W/ 200-220V~
+54V/ 53.4A
+12Vsb/ 3A
– Max 3002.4W/ 220-240V~ or 240Vdc Input
+54V/ 55.6A
+12Vsb/ 3A
[1] The system power supply requires C19 power cord.
GIGABYTE Management Console web interface
- Dashboard
- HTML5 KVM
- Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
- Sensor Reading History Data
- FRU Information
- SEL Log in Linear Storage / Circular Storage Policy
- Hardware Inventory
- Fan Profile
- System Firewall
- Power Consumption
- Power Control
- Advanced power capping
- LDAP / AD / RADIUS Support
- Backup & Restore Configuration
- Remote BIOS/BMC/CPLD Update
- Event Log Filter
- User Management
- Media Redirection Settings
- PAM Order Settings
- SSL Settings
- SMTP Settings
2 x 60x60x56mm
2 x 60x60x76mm
PCIe slots:
4 x 80x80x56mm
GPU tray:
4 x 60x60x38mm
Operating humidity: 8% to 80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20% to 95% (non-condensing)
[Note] To ensure system stability and prevent condensation, when the relative humidity exceeds 50%, the coolant inlet temperature must be higher than the dry-bulb temperature and it should not exceed 45°C.
1 x L-shape Rail kit
– Motherboard: 9MZB3PE0UR-000*
– L-shape Rail kit: 25HB2-A96102-K0R
– CoolIT CPU cold plate loop: 25ST7-20000S-C4R
– CoolIT GPU cold plate loop: 25ST7-3000ZF-C4R/25ST7-3000ZG-C4R
– CoolIT NVSwitch cold plate loop: 25ST7-3000ZE-C4R
– Front panel board – CFPG540: 9CFPG540NR-00*
– Backplane board – CBPG641: 9CBPG641NR-00*
– Fan module 60x60x38mm: 25ST2-663830-F1R
– Fan module 60x60x38mm: 25ST2-663831-F1R
– Fan module 60x60x56mm: 25ST2-665623-S1R
– Fan module 60x60x76mm: 25ST2-667621-A0R
– Fan module 80x80x56mm: 25ST2-885622-A0R
– PCIe bridge board – CPBG045: 9CPBG045NR-00*
– PCIe switch board – CBG76: 9CBG76NR-00*
– Rear MLAN board – CDB66: 9CDB66NR-00*
– Leak sensor board – CNBG72: 9CNBG72NR-00*
– Power supply: 25EP0-203K01-D0S
[#2] All materials provided herein are for reference only. GIGABYTE reserves the right to modify or revise the content at any time without prior notice.
[#3] Advertised performance is based on maximum theoretical values as specified by the respective chipset vendors or standards organizations. Actual performance may vary depending on system configuration.
[#4] All trademarks and logos are the property of their respective owners.
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