Gigabyte DLB2-CB1 GB200 NVL72 186GB (4) NVIDIA Grace CPU (2) AI Graphics Card GPU
Gigabyte DLB2-CB1 GB200 NVL72 186GB (4) NVIDIA Grace CPU (2) AI Graphics Card GPU Original price was: $769,900.00.Current price is: $699,900.00.
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HPE ProLiant DL384 Gen11 1P GH200 480GB 144GB 12V Partner-Cooled (1) NVIDIA Grace CPU (1)AI Graphics Card GPU Server
HPE ProLiant DL384 Gen11 1P GH200 480GB 144GB 12V Partner-Cooled (1) NVIDIA Grace CPU (1)AI Graphics Card GPU Server Original price was: $769,900.00.Current price is: $699,900.00.

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Gigabyte XN24-VC0-L XN24-VC0-LA61 GB200 NVL4 (4) NVIDIA Grace CPU (4) AI Graphics Card GPU

XN24-VC0-LA61

NVIDIA GB200 NVL4 Full-System DLC Server
  • Direct liquid-cooled NVIDIA GB200 NVL4 solution with integrated piping for over 85% system heat coverage
  • 4 x 800 Gb/s liquid-cooled OSFP InfiniBand XDR or dual 400 Gb/s Ethernet GPU networking ports via NVIDIA ConnectX®-8 SuperNIC™
  • 4 x 186GB HBM3E GPU memory
  • 2 x 480GB LPDDR5X ECC CPU memory
  • 1 x 1Gb/s LAN port via Intel® I210-AT
  • 8 x liquid-cooled 2.5″ Gen5 NVMe bays
  • 4 x liquid-cooled 2.5″ Gen5 NVMe bays via NVIDIA® BlueField®-3 DPU (optional)
  • 1 x M.2 slot with PCIe Gen5 x4 interface
  • 1 x liquid-cooled FHHL PCIe Gen5 x16 slot for NVIDIA® BlueField®-3 DPUs
  • 1 x FHHL PCIe Gen5 x16 slot
  • 4 x 3200W 80 PLUS Titanium redundant power supplies
Ordering Numbers: 6NXN24VC0RR000LA61*

Original price was: $769,900.00.Current price is: $699,900.00.

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Description

NVIDIA GB200 NVL4

Continuing the evolution of GPU-accelerated computing, the NVIDIA GB200 NVL4 is engineered to deliver revolutionary performance for next-generation giant-scale AI and scientific workloads. Built on the cutting-edge Blackwell architecture, it integrates four NVIDIA Blackwell GPUs connected via an NVLink bridge and two NVIDIA Grace™ CPUs over NVLink-C2C technology, forming a highly efficient, unified computational module.

This breakthrough architecture features 1.8 TB of fast coherent memory, enabling the processing of massive datasets and complex simulations with unprecedented efficiency. Optimized for advanced liquid-cooling systems, the GB200 NVL4 provides up to 2x performance for AI model training and inference over the prior generation. This platform empowers developers and researchers to maximize computational throughput and accelerate innovation across the most demanding HPC and AI environments.

4 BlackwellGPUs

2 GraceCPUs

32 TB/sBandwidth

1.8 TBFast Memory

2x FasterHPC Generation

XN24-VC0-LA61 Product Overview

XN24-VC0-LA61 Block Diagram

Dimensions (WxHxD, mm)
2U
438 x 87 x 900
Superchip
2 x liquid-cooled NVIDIA GB200 Grace Blackwell Superchips
Per superchip:
– 1 x NVIDIA Grace™ CPU
– 2 x NVIDIA Blackwell GPUs
– CPU and GPU connected with NVIDIA NVLink™-C2C
– GPU and GPU connected with NVIDIA NVLink™
– GPU TDP up to 1200W
Memory
NVIDIA Grace™ CPU:
– 480GB of LPDDR5X memory with ECC
– Memory bandwidth up to 512GB/s

NVIDIA Blackwell GPU:
– 186GB HBM3E
– Memory bandwidth up to 8TB/s

LAN
Rear:
4 x 800 Gb/s liquid-cooled OSFP InfiniBand XDR or dual 400 Gb/s Ethernet, for GPU networking, via NVIDIA ConnectX®-8 SuperNIC™

1 x 1Gb/s LAN (1 x Intel® I210-AT)
– Supports NCSI function

1 x 10/100/1000 Mbps Management LAN

Video
Integrated in ASPEED® AST2600
– 1 x Mini-DP
Storage
Front:
8 x liquid-cooled 2.5″ Gen5 NVMe
– (NVMe from ConnectX®-8 SuperNIC™)

Optional front:
4 x liquid-cooled 2.5″ Gen5 NVMe
– (NVMe from NVIDIA® BlueField®-3 DPUs) [1]

Internal M.2:
1 x M.2 (2242/2260/2280/22110), PCIe Gen5 x4, from CPU_1

[1] Requires optional NVIDIA® BlueField®-3 DPU.

PCIe Expansion Slots
PCIe Cable x 2:
– 1 x liquid-cooled FHHL x16 (Gen5 x16), from CPU_0, for DPUs
– 1 x FHHL x16 (Gen5 x16), from CPU_1
Front I/O
I/O board:
1 x Power button with LED
1 x ID button with LED
1 x Reset button
12 x Storage activity LEDs
Rear I/O
4 x OSFP ports

I/O board:
1 x USB 3.2 Gen1 port (Type-A)
1 x Micro USB port (for debug only)
1 x Mini-DP
1 x RJ45 port
1 x MLAN port
1 x Power button with LED
1 x ID button with LED
1 x BMC reset button
1 x System status LED
1 x NVLink status LED

Security Modules
RoT and Dual ROM
TPM: CTM013
Power Supply[#1]
4 x 3200W 80 PLUS Titanium redundant power supplies [1]

AC Input:
– 100-127V~/ 16A, 50-60Hz
– 200-220V~/ 16A, 50-60Hz
– 220-240V~/ 16A, 50-60Hz

DC Input: (Only for China)
– 240Vdc/ 16A

DC Output:
– Max 1300W/ 100-127V~
+12.2V/ 106.6A
+12.2Vsb/ 3A
– Max 3000W/ 200-220V~
+12.2V/ 246A
+12.2Vsb/ 3A
– Max 3200W/ 220-240V~ or 240Vdc Input
+12.2V/ 262.3A
+12.2Vsb/ 3A

[1] The system power supply requires C19 power cord.

System Fans
1 x 40x40x56mm
Operating Properties
Operating temperature: 10°C to 35°C
Operating humidity: 8% to 80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20% to 95% (non-condensing)

[Note] To ensure system stability and prevent condensation, when the relative humidity exceeds 50%, the coolant inlet temperature must be higher than the dry-bulb temperature and it should not exceed 45°C.

Weight
Net Weight: 42.8 kg
Gross Weight: 50 kg
Packaging Dimensions
1178 x 730 x 387 mm
Packaging Content
1 x XN24-VC0-LA61
1 x Mini-DP to D-Sub cable
1 x 3-Section Rail kit
Part Numbers
– Barebone package: 6NXN24VC0RR000LA61*
– 3-Section Rail kit: 25HB2-UKJH00-K0R

Optional parts:

– Cable Management Arm: 25HB2-2AA700-K0R

[#1] Power cords are not included with server packages. Customers are responsible for selecting appropriate power cords from the optional accessories or contacting sales for customization.
[#2] All materials provided herein are for reference only. GIGABYTE reserves the right to modify or revise the content at any time without prior notice.
[#3] Advertised performance is based on maximum theoretical values as specified by the respective chipset vendors or standards organizations. Actual performance may vary depending on system configuration.
[#4] All trademarks and logos are the property of their respective owners.
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