ASUS ESC NM2N721-E1 GB200 NVL72 186GB (4) NVIDIA Grace CPU (2) AI Graphics Card GPU
ASUS ESC NM2N721-E1 GB200 NVL72 186GB (4) NVIDIA Grace CPU (2) AI Graphics Card GPU Original price was: $769,900.00.Current price is: $699,900.00.
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Gigabyte XN24-VC0-L XN24-VC0-LA61 GB200 NVL4 (4) NVIDIA Grace CPU (4) AI Graphics Card GPU
Gigabyte XN24-VC0-L XN24-VC0-LA61 GB200 NVL4 (4) NVIDIA Grace CPU (4) AI Graphics Card GPU Original price was: $769,900.00.Current price is: $699,900.00.

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Gigabyte DLB2-CB1 GB200 NVL72 186GB (4) NVIDIA Grace CPU (2) AI Graphics Card GPU

XH23-VG0-AAJ1

NVIDIA MGX™ Arm Server – NVIDIA GH200 Grace Hopper™ Superchip – 2U UP 4-Bay Gen5 NVMe
  • NVIDIA-Certified Systems™ – NVIDIA ARM CPU Systems
  • CPU+GPU design for giant-scale AI and HPC
  • NVIDIA MGX™ modular server design
  • Single NVIDIA GH200 Grace Hopper™ Superchip
  • 900GB/s NVIDIA NVLink™-C2C Interconnect
  • 480GB CPU LPDDR5X ECC memory
  • Up to 144GB GPU HBM3E
  • Compatible with NVIDIA® BlueField®-3 DPUs
  • 2 x 10Gb/s LAN ports via Intel® X550-AT2
  • 4 x 2.5″ Gen5 NVMe bays
  • 2 x M.2 slots with PCIe Gen5 x4 interface
  • 3 x FHFL PCIe Gen5 x16 slots
  • 1+1 2000W 80 PLUS Titanium redundant power supply
Ordering Numbers:
96GB HBM3: 6NXH23VG0MR000AAJ1*
144GB HBM3E: 6NXH23VG0MR000ABJ1*

Original price was: $769,900.00.Current price is: $699,900.00.

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Description

tepping Further into the Era of AI and GPU-Accelerated HPC

Moving beyond pure CPU applications, the NVIDIA GH200 Grace Hopper Superchip is built on a combination of an NVIDIA Grace™ CPU and an NVIDIA H100 Tensor Core GPU for giant-scale AI and HPC applications. Utilizing the same NVIDIA® NVLink®-C2C technology, combining the heart of computing on a single superchip, forming the most powerful computational module. The coherent memory design leverages both high-speed HBM3 or HBM3e GPU memory and the large-storage LPDDR5X CPU memory. The superchip also inherits the capability of scaling out with InfiniBand networking by adopting NVIDIA BlueField®-3 DPUs or NICs, forming a system connected with a speed of 100GB/s for ML and HPC workloads. The upcoming NVIDIA GH200 NVL32 can further improve deep learning and HPC workloads by connecting up to 32 superchips through the NVLink Switch System, a system built on NVLink switches with 900GB/s bandwidth between any two superchips, making the most use of the powerful computing chips and extended GPU memory.

NVIDIA GH200 Grace Hopper Superchip

NVIDIA Grace Hopper Superchip

 72 Arm Neoverse V2 Cores

Armv9.0-A architecture for better compatibility and easier execution of other Arm-based binaries.

 Up to 480GB CPU LPDDR5X memory with ECC

Balancing between bandwidth, energy efficiency, capacity, and cost with the first data center implementation of LPDDR technology.

 96GB HBM3 or 144GB HBM3e GPU memory

Adoption of high-bandwidth-memory for improved performance of memory-intensive workloads.

 Up to 4x PCIe Gen5 x16 links

Multiple PCIe Gen5 links for flexible add-in cards configurations and system communication.

 NVIDIA® NVLink®-C2C Technology

Industry-leading chip-to-chip interconnect technology up to 900GB/s, alleviating bottlenecks and making coherent memory interconnect possible.

 InfiniBand Networking Systems

Designed with maximum scale-out capability with up to 100GB/s total bandwidth across all superchips through InfiniBand switches, BlueField-3 DPUs, and ConnectX-7 NICs.

 Easy-to-Program Heterogeneous Platform

Bringing preferred programming languages to the CUDA platform along with hardware-accelerated memory coherency for simple adaptation to the new platform.

XH23-VG0-AAJ1 Block Diagram

XH23-VG0-AAJ1 Product Overview

Dimensions (WxHxD, mm)
2U
438 x 87 x 900
Motherboard
MVG3-MG0
Superchip
NVIDIA GH200 Grace Hopper™ Superchip:
– 1 x NVIDIA Grace™ CPU
– 1 x NVIDIA Hopper™ GPU
– Connected with NVIDIA NVLink™-C2C
– TDP up to 1000W (CPU + GPU + memory)
Memory
NVIDIA Grace™ CPU:
– 480GB of LPDDR5X memory with ECC
– Memory bandwidth up to 512GB/sNVIDIA Hopper™ GPU:
– 96GB HBM3 [1]
– Memory bandwidth up to 4TB/s [1][1] Modules with 144GB of HBM3E GPU memory and 4.9TB/s memory bandwidth are also available. Please contact our sales representatives for more details.

LAN
Front:
2 x 10Gb/s LAN (1 x Intel® X550-AT2)
– Support NCSI function1 x 10/100/1000 Mbps Management LAN
Video
Integrated in ASPEED® AST2600
– 1 x Mini-DP
Storage
Front:
4 x 2.5″ Gen5 NVMe
– (NVMe from PEX89048)Internal M.2 (CMTP0A3):
2 x M.2 (2242/2260/2280/22110), PCIe Gen5 x4, from PEX89048
SAS
N/A
RAID
N/A
PCIe Expansion Slots
PCIe Cable x 3:
– 3 x FHFL x16 (Gen5 x16), from CPU
Front I/O
2 x USB 3.2 Gen1 ports (Type-A)
1 x Mini-DP
2 x RJ45 ports
1 x MLAN port
1 x Power button with LED
1 x ID button with LED
1 x Reset button
1 x Storage activity LED
1 x System status LED
Rear I/O
N/A
Backplane Board
Speed and bandwidth:
PCIe Gen5 x4
Security Modules
1 x TPM header with SPI interface
– Optional TPM2.0 kit: CTM012
Power Supply[#1]

1+1 2000W 80 PLUS Titanium redundant power supplies

AC Input:
– 100-127V~/ 13A, 50-60Hz
– 200-220V~/ 10A, 50-60Hz
– 220-240V~/ 10A, 50-60Hz

DC Input: (Only for China)
– 240Vdc/ 10A

DC Output:
– Max 1000W/ 100-127V~
+12.2V/ 82A
+12.2Vsb/ 3A
– Max 1800W/ 200-220V~
+12.2V/ 148A
+12.2Vsb/ 3A
– Max 2000W/ 220-240V~ or 240Vdc Input
+12.2V/ 164A
+12.2Vsb/ 3A

System Management
ASPEED® AST2600 Baseboard Management Controller
GIGABYTE Management Console web interface

  • Dashboard
  • HTML5 KVM
  • Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
  • Sensor Reading History Data
  • FRU Information
  • SEL Log in Linear Storage / Circular Storage Policy
  • Hardware Inventory
  • Fan Profile
  • System Firewall
  • Power Consumption
  • Power Control
  • Advanced power capping
  • LDAP / AD / RADIUS Support
  • Backup & Restore Configuration
  • Remote BIOS/BMC/CPLD Update
  • Event Log Filter
  • User Management
  • Media Redirection Settings
  • PAM Order Settings
  • SSL Settings
  • SMTP Settings
OS Compatibility
Please refer to OS compatibility table in support page
System Fans
3 x 60x60x56mm (24,000/23,200rpm)
4 x 80x80x80mm (18,700/15,100rpm)
Operating Properties
Operating temperature: 10°C to 35°C
Operating humidity: 8% to 80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20% to 95% (non-condensing)
Weight
Net Weight: 27.6 kg
Gross Weight: 29.4 kg
Packaging Dimensions
1196 x 744 x 400 mm
Packaging Content
1 x XH23-VG0-AAJ1
2 x Superchip heatsinks
1 x Mini-DP to D-Sub cable
1 x 3-Section Rail kit
Part Numbers
– Barebone with 96GB HBM3 module: 6NXH23VG0MR000AAJ1*
– Barebone with 144GB HBM3E module: 6NXH23VG0MR000ABJ1*
– Motherboard: 9MVG3MG0NR-000*
– 3-Section Rail kit: 25HB2-T76100-K0R
– Superchip heatsink: 25ST1-1532G0-M1R/25ST1-3Z32G1-M1R
– Front panel board – CFPX140: 9CFPX140NR-00*
– Backplane board – CBPX060: 9CBPX060NR-00*
– Fan module 60x60x56mm: 25ST2-665620-S1R
– Fan module 80x80x80mm: 25ST2-888024-D0R
– M.2 riser card – CMTP0A3: 9CMTP0A3NR-00*
– DC-SCM board – CDCX100: 9CDCX100NR-00*
– Mini-DP to D-Sub cable: 25CRN-200801-K1R
– Power supply: 25EP0-22000P-G1SOptional parts:– Cable Management Arm: 25HB2-2AA700-K0R
– RMA packaging: 6NXH23VG0SR-RMA-A100

[#1] Power cords are not included with server packages. Customers are responsible for selecting appropriate power cords from the optional accessories or contacting sales for customization.
[#2] All materials provided herein are for reference only. GIGABYTE reserves the right to modify or revise the content at any time without prior notice.
[#3] Advertised performance is based on maximum theoretical values as specified by the respective chipset vendors or standards organizations. Actual performance may vary depending on system configuration.
[#4] All trademarks and logos are the property of their respective owners.
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