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HPE Cray XD670 (Apollo 6500 Gen11, 5U)Gen11 HGX H100 H200 8 GPU 80GB

Name: HPE Cray XD670 (Apollo 6500 Gen11, 5U)Gen11 HGX H100 H200 8 GPU 80GB
SKU: 15816
Availability: InStock

HPE Cray XD670

Accelerate AI performance for Large Language Model training, Natural Language Processing, and multimodal training.

Do you need a high performing, dense system to meet the evolving requirements of your AI training workloads? The HPE Cray XD670 system boosts AI performance at scale in a dense 5U form factor. Armed with eight NVIDIA® H200 or H100 Tensor Core GPUs, HPE Cray XD670 is ideal for GPU-intensive workloads such as large language model (LLM) training and natural language processing (NLP) to gain insights from large amounts of data. Optional plug-and-play direct liquid cooling brings power efficiency and enables energy reuse, helping you advance your sustainability goals. Purpose-built storage is integrated with the system, creating a unified architecture that can scale rapidly. HPE Cray XD670 supports a robust portfolio of HPE software to help you streamline the development of AI applications and launch them into production. Exceed the boundaries of what’s possible with HPE Cray XD670, purpose-built for AI at scale.

$380,000.00

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Description

HPE Cray XD670 digital data sheet.PDF

HPE cray supercomputing xd670.pdf

What’s New

Support for eight NVIDIA H200 Tensor Core GPUs with 5th Generation Intel® Xeon® Scalable processors.
Support for up to 32x DDR5 DIMMs, up to 5600 MT/s.
PCIe Gen5 increased data transfer speed over PCIe Gen4, giving faster data transfer speeds for SSDs, GPUs, and other peripheral cards.¹

Key Features

Purpose-built for AI Workloads

The HPE Cray XD670 system is powered by eight NVIDIA H200 or H100 Tensor Core GPUs and Transformer Engine support.

#1 result for Natural Language Processing (NLP) with BERT 99.0 Offline scenario in MLPerf ™ Inference v4.0 benchmark.²

Complete solution for AI that can scale out from one to thousands of nodes to support growing AI environments.

Efficient Flexibility in a Dense Architecture

The HPE Cray XD670 is a 5U chassis system that contains a single 2x CPU node.

Choice of air cooling or plug-and-play direct liquid cooling (DLC) that increases power efficiency and enables energy reuse, helping you advance your sustainability goals.

Purpose-built integrated storage delivers strong read and write performance cost-effectively.

Supports a wide range of interconnect options including InfiniBand, high-speed Ethernet, and HPE Slingshot.

Simplify Management and Deployment

The HPE Cray XD670 system includes industry-standard, DMTF-compliant Redfish for simple and secure system management.

HPE Performance Cluster Manager (HPCM) provides automated provisioning, monitoring, remote support, and firmware updates for HPE Cray XD670.

HPE Services brings together technology and expertise to accelerate your transformation and prepare for what comes next.

¹ Visit URL https://www.intel.com/content/www/us/en/gaming/resources/what-is-pcie-4-and-why-does-it-matter.html

² “New MLPerf Inference Benchmark Results Highlight The Rapid Growth of Generative AI Models,” MLCommons(tm), March 2024

Intel Xeon is a trademark of Intel Corporation or its subsidiaries in the U.S. and/or other countries. NVIDIA is a trademark and/or registered trademark of NVIDIA Corporation in the U.S. and other countries. MLCOMMONS™ and MLPERF™ are trademarks and service marks of MLCommons Association in the United States and other countries. All third-party marks are property of their respective owners.

Chassis
- 5U chassis system
- Single 2x CPU node
GPU acceleration – Option A
- 8x NVIDIA H200 SXM 700W TDP GPUs with 141 GB HBM each
- 2x 5th Gen Intel Xeon Scalable processors CPUs, up to 400W TDP
- 32x DIMMs DDR5, 8-channel memory per socket, up to 5600 MHz
GPU acceleration – Option B
- 8x NVIDIA H100 SXM 700W TDP GPUs with 80 GB HBM each
- 2x 4th Gen Intel Xeon Scalable processors CPUs, up to 300W TDP
- 32x DIMMs DDR5, 8-channel memory per socket, up to 4800 MHz
Power and cooling
- Air cooled and also available with a Direct Liquid Cooling option for improved power efficiency

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