AMD EPYC Embedded 9354P 32 Cores 64 Threads 280 W TDP 3.25 GHz Frequency 3.8 GHz Boost Genoa Codename

AMD EPYC Embedded 9354P 32 Cores 64 Threads 280 W TDP 3.25 GHz Frequency 3.8 GHz Boost Genoa Codename

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Description

The AMD EPYC Embedded 9354P is a server/workstation processor with 32 cores, launched in March 2023. It is part of the EPYC lineup, using the Zen 4 (Genoa) architecture with Socket SP5. Thanks to AMD Simultaneous Multithreading (SMT) the core-count is effectively doubled, to 64 threads. EPYC Embedded 9354P has 256 MB of L3 cache and operates at 3.25 GHz by default, but can boost up to 3.8 GHz, depending on the workload. AMD is building the EPYC Embedded 9354P on a 5 nm production process using 52,560 million transistors. The silicon die of the chip is not fabricated at AMD, but at the foundry of TSMC. The multiplier is locked on EPYC Embedded 9354P, which limits its overclocking capabilities.
With a TDP of 280 W, the EPYC Embedded 9354P is extremely power hungry, which means you need top-notch cooling. AMD’s processor supports DDR5 memory with a twelve-channel interface. The highest officially supported memory speed is 4800 MT/s, but with overclocking (and the right memory modules) you can go even higher. ECC memory is supported, too, which is an important capability for mission-critical systems, to avoid data corruption. For communication with other components in the computer, EPYC Embedded 9354P uses a PCI-Express Gen 5 connection. This processor lacks integrated graphics, you might need a graphics card.
Hardware virtualization is available on the EPYC Embedded 9354P, which greatly improves virtual machine performance. Programs using Advanced Vector Extensions (AVX) will run on this processor, boosting performance for calculation-heavy applications. Besides AVX, AMD has added support for the newer AVX2 and AVX-512 instructions, too.

Physical

Socket: AMD Socket SP5
Foundry: TSMC
Process Size: 5 nm
Transistors: 52,560 million
Die Size: 8x 72 mm²
I/O Process Size: 6 nm
I/O Transistors: 11,000 million
I/O Die Size: 397 mm²
Package: FC-LGA6096

Processor

Market: Server/Workstation
Production Status: Active
Release Date: Mar 14th, 2023
Part#: 100-100000920

Performance

Frequency: 3.25 GHz
Turbo Clock: up to 3.8 GHz
All-Core Turbo: 3.75 GHz
Base Clock: 100 MHz
Multiplier: 32.5x
Multiplier Unlocked: No
TDP: 280 W
Configurable TDP: 240-300 W

Architecture

Codename: Genoa
Generation: EPYC
(Zen 4 (Genoa))
Memory Support: DDR5
Rated Speed: 4800 MT/s
Memory Bus: Twelve-channel
ECC Memory: Yes
PCI-Express: Gen 5, 128 Lanes
(CPU only)

Core Config

# of Cores: 32
# of Threads: 64
SMP # CPUs: 1
Integrated Graphics: N/A

Cache

Cache L1: 64 KB (per core)
Cache L2: 1 MB (per core)
Cache L3: 256 MB (shared)

Features

  • MMX
  • SSE
  • SSE2
  • SSE3
  • SSSE3
  • SSE4A
  • SSE4.1
  • SSE4.2
  • AES
  • AVX
  • AVX2
  • AVX-512
  • VNNI
  • BMI1
  • BMI2
  • BFloat16
  • SHA
  • F16C
  • FMA3
  • AMD64
  • EVP
  • AMD-V
  • SMAP
  • SMEP
  • X2AVIC
  • AIBRS
  • 5-level NPT
  • SMT
  • Precision Boost 2
  • XFR 2

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