Powering the Next Generation of Server Architecture and Energy Efficiency
The path to AMD’s 5nm ‘Zen 4’ architecture was paved with many successful generations of EPYC innovations and chiplet designs, and AMD EPYC 9004 Series processors continue this progression. Adding a host of new features to target a wide range of workloads, the new family of EPYC processors will deliver even better CPU performance and performance per watt, and do so on a platform with 2x the throughput of PCIe 4.0 lanes that also has support for 50% more memory channels. For this new platform, GIGABYTE has products ready to get the most out of EPYC-based systems that support fast PCIe Gen5 accelerators and Gen5 NVMe drives, in addition to support for high performant DDR5 memory.
4th Gen AMD EPYC Processors for SP5 Socket
5nmarchitecture
Compute density increased with more transistors packed in less space
128CPU cores
Dedicated cores and targeted workloads for Zen 4c & Zen 4 cores
Large L3cache
Select CPUs have 3x or more L3 cache for technical computing
SP5compatibility
All 9004 series processors are supported on one platform
12channels
Memory capacity can achieve 6TB per socket
DDR5memory
Increased memory throughput and higher DDR5 capacity per DIMM
PCIe 5.0lanes
Increased IO throughput achieving 128GB/s bandwidth in PCIe x16 lanes
CXL 1.1+support
Disaggregated compute architecture possible via Compute Express Link
Select GIGABYTE for the AMD EPYC 9004 platform
High Performance
Servers and motherboards by GIGABYTE are tested to ensure peak performance for demanding CPU workloads. All the latest technology is supported.
Compute Density
One single socket solution can outperform many dual CPU servers. Dual socket models also support 192 cores in a 1U chassis. More compact performance.
Fast & Stable Connectivity
Keeping pace with the challenges for next gen technology, well designed GIGABYTE boards provide users the signal integrity for PCIe 5.0
Modularity
Our building block design allows new models to quickly come to market. And users can now have BMC on a OCP module customized by GIGABYTE.
Collaboration
AMD and GIGABYTE have maintained a healthy relationship that values shared knowledge in order to get the latest technology into data centers.
Optimal Price
Our broad portfolio of products and models allows customers to only select the features they require while doing so at a lower TCO.
G593-ZD2-AAX1 Product Overview
G593-ZD2-AAX1 Block Diagram
High Performance
Supports NVIDIA HGX™ H100 8-GPU
The NVIDIA H100 Tensor Core GPU enables an order-of-magnitude leap for large-scale AI and HPC with unprecedented performance, scalability and security for every data center. With NVIDIA AI Enterprise for streamlined AI development and deployment, NVIDIA NVLINK Switch System direct communication between up to 256 GPUs, H100 accelerates everything from exascale scale workloads with a dedicated Transformer Engine for trillion parameter language models, down to right-sized Multi-Instance GPU (MIG) partitions.
Power Efficiency
Automatic Fan Speed Control
GIGABYTE servers are enabled with Automatic Fan Speed Control to achieve the best cooling and power efficiency. Individual fan speeds will be automatically adjusted according to temperature sensors strategically placed in the servers.
Dimensions (WxHxD, mm)
5U
447 x 219.7 x 945
447 x 219.7 x 945
Motherboard
MZB3-G43
CPU
AMD EPYC™ 9004 Series Processors
AMD EPYC™ 9004 Series Processors with AMD 3D V-Cache™ Technology
Dual processor, 5nm technology
*Up to 128 cores, 256 threads per processor
cTDP up to 300W at ambient 35°C
AMD EPYC™ 9004 Series Processors with AMD 3D V-Cache™ Technology
Dual processor, 5nm technology
*Up to 128 cores, 256 threads per processor
cTDP up to 300W at ambient 35°C
*cTDP supported up to 400W under limited thermal conditions. Please contact technical support for more details.
Note: If only 1 CPU is installed, some PCIe or memory functions might be unavailable.
Socket
2 x LGA 6096
Socket SP5
Socket SP5
Chipset
System on Chip
Memory
24 x DIMM slots
DDR5 memory supported only
12-Channel memory architecture
RDIMM up to 96GB supported
3DS RDIMM up to 256GB supported
Memory speed: Up to 4800 MT/s
DDR5 memory supported only
12-Channel memory architecture
RDIMM up to 96GB supported
3DS RDIMM up to 256GB supported
Memory speed: Up to 4800 MT/s
LAN
Front side:
2 x 10Gb/s LAN ports (1 x Intel® X710-AT2)
Support NCSI function
2 x 10Gb/s LAN ports (1 x Intel® X710-AT2)
Support NCSI function
1 x 10/100/1000 Mbps Management LAN
Rear side:
1 x 10/100/1000 Mbps Management LAN
Notice: When both MLAN ports are connected with cables, the front MLAN port will be set as the default.
Video
Integrated in Aspeed® AST2600
2D Video Graphic Adapter with PCIe bus interface
1920×1200@60Hz 32bpp
2D Video Graphic Adapter with PCIe bus interface
1920×1200@60Hz 32bpp
Storage
Front side:
8 x 2.5″ Gen5 NVMe/SATA/SAS-4* hot-swappable bays, NVMe from PEX89104
8 x 2.5″ Gen5 NVMe/SATA/SAS-4* hot-swappable bays, NVMe from PEX89104
*Storage card is required to support SATA and SAS drives.
SAS
Require SAS add-in cards
RAID
Require RAID add-in cards
Expansion Slots
NVIDIA HGX™ H100 with 8 x SXM5 GPUs
Extension Board CPBG044 x 2:
– 8 x PCIe x16 (Gen5 x16) low-profile slots, from PEX89104
PCIe Cable x 4:
– 2 x PCIe x16 (Gen5 x16) FHHL slots, from CPU_0
– 2 x PCIe x16 (Gen5 x16) FHHL slots, from CPU_1
1 x M.2 slot:
– M-key
– PCIe Gen3 x4, from CPU_1
– Supports 2280/22110 cards
1 x M.2 slot:
– M-key
– PCIe Gen3 x1, from CPU_0
– Supports 2280/22110 cards
Internal I/O
1 x TPM header
Front I/O
2 x USB 3.2 Gen1
1 x VGA
2 x RJ45
1 x MLAN (default port)
1 x Power button with LED
1 x ID button with LED
1 x NMI button
1 x Reset button
1 x Storage activity LED
1 x System status LED
1 x VGA
2 x RJ45
1 x MLAN (default port)
1 x Power button with LED
1 x ID button with LED
1 x NMI button
1 x Reset button
1 x Storage activity LED
1 x System status LED
Rear I/O
1 x MLAN
Backplane Board
Speed and bandwidth:
PCIe Gen5 x4 or SATA 6Gb/s or SAS-4 24Gb/s
PCIe Gen5 x4 or SATA 6Gb/s or SAS-4 24Gb/s
TPM
1 x TPM header with SPI interface
– Optional TPM2.0 kit: CTM010
– Optional TPM2.0 kit: CTM010
Power Supply
4+2 3000W 80 PLUS Titanium redundant power supplies
AC Input:
– 115-127V~/ 14.2A, 50-60Hz
– 200-220V~/ 15.8A, 50-60Hz
– 220-240V~/ 14.9A, 50-60Hz
DC Input: (Only for China)
– 240Vdc/ 14A
DC Output:
– Max 1450W/ 115-127V~
+54V/ 26.6A
+12Vsb/ 3A
– Max 2900W/ 200-220V~
+54V/ 53.4A
+12Vsb/ 3A
– Max 3002.4W/ 220-240V~ or 240Vdc Input
+54V/ 55.6A
+12Vsb/ 3A
Note: The system power supply requires C19 power cord.
System Management
Aspeed® AST2600 management controller
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface
GIGABYTE Management Console (AMI MegaRAC SP-X) web interface
- Dashboard
- HTML5 KVM
- Sensor Monitor (Voltage, RPM, Temperature, CPU Status …etc.)
- Sensor Reading History Data
- FRU Information
- SEL Log in Linear Storage / Circular Storage Policy
- Hardware Inventory
- Fan Profile
- System Firewall
- Power Consumption
- Power Control
- Advanced power capping
- LDAP / AD / RADIUS Support
- Backup & Restore Configuration
- Remote BIOS/BMC/CPLD Update
- Event Log Filter
- User Management
- Media Redirection Settings
- PAM Order Settings
- SSL Settings
- SMTP Settings
OS Compatibility
Please refer to OS compatibility table in support page
Additional certifications:
Windows Server 2022 (x64)
System Fans
Motherboard:
2 x 40x40x56mm (29,700rpm)
4 x 60x60x56mm (24,000rpm)
2 x 40x40x56mm (29,700rpm)
4 x 60x60x56mm (24,000rpm)
PCIe slots:
4 x 40x40x28mm (25,000rpm)
2 x 40x40x56mm (29,700rpm)
GPU tray:
6 x 60x60x76mm (21,700rpm)
6 x 80x80x80mm (17,000rpm)
5 x 80x80x80mm (17,200rpm)
Operating Properties
Operating temperature: 10°C to 35°C
Operating humidity: 8%-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Operating humidity: 8%-80% (non-condensing)
Non-operating temperature: -40°C to 60°C
Non-operating humidity: 20%-95% (non-condensing)
Weight
Net Weight: 91 kg
Gross Weight: 100 kg
Gross Weight: 100 kg
Packaging Dimensions
1200 x 890 x 700 mm
Packaging Content
1 x G593-ZD2-AAX1
2 x CPU heatsinks
1 x L-shape Rail kit
2 x CPU heatsinks
1 x L-shape Rail kit
Part Numbers
– Barebone w/ NVIDIA module: 6NG593ZD2DR000AAX1*
– Motherboard: 9MZB3G43UR-000
– L-shape Rail kit: 25HB2-A96102-K0R
– CPU heatsink: 25ST1-44320Z-C1R
– Front panel board – CFPG540: 9CFPG540NR-00
– Backplane board – CBPG680: 9CBPG680NR-00
– Fan module 80x80x80mm: 25ST2-808037-S1R
– Fan module 80x80x80mm: 25ST2-888032-S1R
– Fan module 60x60x76mm: 25ST2-667630-S1R
– Fan module 60x60x56mm: 25ST2-665620-S1R
– Fan module 40x40x56mm: 25ST2-40562G-A0R
– Fan module 40x40x56mm: 25ST2-40562L-A0R
– Fan module 40x40x28mm: 25ST2-44282D-D0R
– I/O board – CDB66: 9CDB66NR-00
– PCIe extension board – CPBG044: 9CPBG044NR-00
– PCIe switch board – CPBG902: 9CPBG902NR-00
– Power supply: 25EP0-23000J-D0S
– Motherboard: 9MZB3G43UR-000
– L-shape Rail kit: 25HB2-A96102-K0R
– CPU heatsink: 25ST1-44320Z-C1R
– Front panel board – CFPG540: 9CFPG540NR-00
– Backplane board – CBPG680: 9CBPG680NR-00
– Fan module 80x80x80mm: 25ST2-808037-S1R
– Fan module 80x80x80mm: 25ST2-888032-S1R
– Fan module 60x60x76mm: 25ST2-667630-S1R
– Fan module 60x60x56mm: 25ST2-665620-S1R
– Fan module 40x40x56mm: 25ST2-40562G-A0R
– Fan module 40x40x56mm: 25ST2-40562L-A0R
– Fan module 40x40x28mm: 25ST2-44282D-D0R
– I/O board – CDB66: 9CDB66NR-00
– PCIe extension board – CPBG044: 9CPBG044NR-00
– PCIe switch board – CPBG902: 9CPBG902NR-00
– Power supply: 25EP0-23000J-D0S
Optional parts:
– C19 power cord 125V/15A (US): 25CP1-018000-Q0R
– C19 power cord 250V/16A (EU): 25CP3-01830H-Q0R
– C19 power cord 125V/15A (JP): 25CPA-01830B-Q0R
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